Driven by the continual rollout of 5G/6G and the expansion of AI servers in data centers, the high-frequency and high-speed copper clad laminate(CCL) market is expected to experience robust growth. Our ongoing research aims to develop laminates that support even higher frequencies, higher speeds, better thermal management and greater reliability.

Modified the polytetrafluoroethylene(PTFE) and other resins(_) having low dielectric constant (Dk) with nanoceramic composite, we are manufacturing high-frequency and high-speed CCLs with super stable dielectric constant (Dk), ultra-low dissipation factor (Df) and high thermal conductivity.

These copper clad laminates (CCLs) can be fabricated into printed circuit boards (PCBs) for 5G/6G and AI servers in data centers through standard circuit board processing techniques, with minor modifications as described in the application note “Fabrication Guidelines for NaFxxxx Series High-frequency or High-speed Circuit Materials.